Heat Sink Paste Injection (Big) |Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets

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product Specification:

This product has high thermal conductivity, high insulation, high temperature bearing, not easy dried, non-volatile, non-toxic, tasteless, non-corrosive
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, thereby increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C.

Heat Sink Paste Injection (Big) |Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets

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MRP: ₹199 ₹32 (Exclusive tax)

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SKU: GP-10263

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Product Description

This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency, very easy to use, even for beginners.The possibilities for its application and the most effectively way to avoid voids between CPU and cooler.Safe Application: It does not contain any metallic particles so electical conductivity would not be an issue. Unlike silver and copper compound, it ensures that get with any electrical pins would not result in damage of any sort. High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. A high performance thermal compound perfect for system builders. Color: Grey Thermal Conductivity:
1.93W/ Thermal resistance:
0.225 Operating temperature: -30 to 180 Celsius Weight: 30g Shelf Life: Two years Notice :Thermal conductivity.
Material : Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.